- BS 6221-25, Withdrawn without replacement, Printed wiring boards. Guide to the rework and repair of soldered surface mounted printed board assemblies
- BS EN 61249-4-18, 2013 Edition, Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- BS EN 61249-4-19, 2013 Edition, Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- BS QC 200012, Withdrawn without replacement, Process assessment schedule for printed board design facilities
- IEC 60050-114, Edition 1.0, International electrotechnical vocabulary - Part 114: Electrochemistry
- IEC 61190-1-2, Edition 3.0, Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
- IEC 61837-2 Amendment 1, Amendment 1 for Edition 2.0, Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
- IEC 61967-8, Edition 1.0, Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
- IEC 62629-12-1, Edition 1.0, 3D Display devices - Part 12-1: Measuring methods for stereoscopic displays using glasses - Optical
- IEC 62647-3, Edition 1.0, Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes (Replaces IEC/PAS 62647-3)
- IEC 62715-6-1, Edition 1.0, Flexible display devices - Part 6-1: Mechanical stress test methods
- IEC 62761, Edition 1.0, Guidelines for the measurement method of nonlinearity for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF)
- IPC 4101, Revision D, Specification for Base Materials for Rigid and Multilayer Printed Boards
- J-STD-030, Revision A, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
- MIL-STD-883, Revision J with Change Notice 3, Test Method Standard - Microcircuits
For similar standards, please follow the links on our page Document Center List of Standards on Electronics.
You'll also want to review this quarter's blog:
And if you'd like to see smiliar U.S. Military documents, please see our Document Center List for FSC 5962, Microcircuits.
