Wednesday, December 11, 2013

New Electronic Component Standards for the 3rd Quarter 2013

Document Center Inc. is pleased to announce that the following New Standards on Electronic Components in General are now available:


  • ASTM E1854, 2013 Edition, Standard Practice for Ensuring Test Consistency in Neutron-Induced Displacement Damage of Electronic Parts
  • BS EN 60286-3, 2013 Edition, Packaging of components for automatic handling.  Packaging of surface mount components on continuous tapes
  • BS EN 60286-3-1, Withdrawn and Replaced by BS EN 60286-3, Packaging of components for automatic handling.  Packaging of surface mount components on continuous tapes. Type V. Pressed carrier tapes
  • BS EN 60286-3-2, Withdrawn and Replaced by BS EN 60286-3, Packaging of components for automatic handling.  Packaging of surface mount components on continuous tapes. Type VI. Blister carrier tapes of 4 mm width
  • BS EN 62321, Withdrawn and Replaced by BS EN 62321-1, Electrotechnical products. Determination of levels of six regulated substances (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers)
  • BS EN 62321-1, 2013 Edition, Determination of certain substances in electro technical products. Introduction and overview
  • IEC 60286-4, Edition 3.0, Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
  • IEC 62647-21, Edition 1.0, Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics





For more standards like this, please see our Document Center List of Standards on Electronic Components in General.

You may also want to review my previous blog:


StandardsForum.com has a review of the 3 new IEC 62647 Standards if you're interested in lead-free electronics for the aerospace industry as well: