- BS 6221-25, Withdrawn without replacement, Printed wiring boards. Guide to the rework and repair of soldered surface mounted printed board assemblies
- BS EN 61249-4-18, 2013 Edition, Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- BS EN 61249-4-19, 2013 Edition, Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- BS QC 200012, Withdrawn without replacement, Process assessment schedule for printed board design facilities
- IPC 1752, Revision A with Amendments 1 and 2, Materials Declaration Management
- IPC 1753, 2014 first release, Laboratory Report Standard
- IPC 1755, 2014 first release, Conflict Minerals Data Exchange Standard
- IPC 4103, Revision A with Amendment 1, Specification for Base Materials for High Speed/High Frequency Applications
- IPC 6013, Revision C, Qualification and Performance Specification for Flexible Printed Boards
For similar standards, please see our Document Center List of Standards on Printed Circuits And Boards.
