Thursday, May 22, 2014

New Printed Circuits And Board Standards for the 1st Quarter 2014

Document Center Inc. is pleased to announce that the following New Standards on Printed Circuits And Boards are now available:


  • BS 6221-25, Withdrawn without replacement, Printed wiring boards. Guide to the rework and repair of soldered surface mounted printed board assemblies
  • BS EN 61249-4-18, 2013 Edition, Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  • BS EN 61249-4-19, 2013 Edition, Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  • BS QC 200012, Withdrawn without replacement, Process assessment schedule for printed board design facilities
  • IPC 1752, Revision A with Amendments 1 and 2, Materials Declaration Management 
  • IPC 1753, 2014 first release, Laboratory Report Standard
  • IPC 1755, 2014 first release, Conflict Minerals Data Exchange Standard
  • IPC 4103, Revision A with Amendment 1, Specification for Base Materials for High Speed/High Frequency Applications
  • IPC 6013, Revision C, Qualification and Performance Specification for Flexible Printed Boards