- AS 6174, Revision A, Counterfeit Materiel; Assuring Acquisition of Authentic and Conforming Materiel
- BS EN 62321-2, 2014 Edition, Determination of certain substances in electrotechnical products. Disassembly, disjointment and mechanical sample preparation
- BS EN 62321-3-1, 2014 Edition, Determination of certain substances in electrotechnical products. Screening. Lead, mercury, cadmium, total chromium and total bromine by X-ray fluorescence spectrometry
- BS EN 62321-3-2, 2014 Edition, Determination of certain substances in electrotechnical products. Screening. Total bromine in polymers and electronics by Combustion. Ion Chromatography
- BS EN 62321-4, 2014 Edition, Determination of certain substances in electrotechnical products. Mercury in polymers, metals and electronics by CV-AAS, CV-AFS, ICP-OES and ICP-MS
- BS EN 62321-5, 2014 Edition, Determination of certain substances in electrotechnical products. Cadmium, lead and chromium in polymers and electronics and cadmium and lead in metals by AAS, AFS, ICP-OES and ICP-MS
- IEC 62668-1, Edition 2.0, Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
- IEC 62668-2, Edition 1.0, Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
- IPC 1752, Revision A with Amendments 1 and 2, Materials Declaration Management
- IPC 1755, 2014 Edition, Conflict Minerals Data Exchange Standard
- IPC 4101, Revision D, Specification for Base Materials for Rigid and Multilayer Printed Boards
- IPC 4103, Revision A with Amendment 1, Specification for Base Materials for High Speed/High Frequency Applications
- IPC 8701, 2014 Edition, Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
- ISO 16678, 1st Edition, Guidelines for interoperable object identification and related authentication systems to deter counterfeiting and illicit trade
- J-STD-030, Revision A, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
- MIL-STD-883, Revision J with Change Notice 4, Test Method Standard for Microcircuits
For similar standards, please see our Document Center List of Standards on Electronic Components.
You'll also want to review my two previous blogs:
And if you're concerned about the introduction of counterfeit components into the supply chain, you'll want to read my StandardsForum.com blogs on the following standards:
ISO 16678, Guidelines for interoperable object identification and related authentication systems to deter counterfeiting and illicit trade
