- BS EN 60747-5-5, 2011 Edition with Amendment A1, Semiconductor devices. Discrete devices. Optoelectronic devices. Photocouplers
- BS EN 62007-1, 2015 Edition, Semiconductor optoelectronic devices for fibre optic system applications. Specification template for essential ratings and characteristics
- BS EN 62031, 2008 Edition with Amendment A2, LED modules for general lighting. Safety specifications
- BS EN 62047-15, 2015 Edition, Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass
- BS EN 62047-16, 2015 Edition, Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods
- BS EN 62047-17, 2015 Edition, Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films
- IEC 60700-1, Edition 2.0, Thyristor valves for high voltage direct current (HVDC) power transmission - Part 1: Electrical testing
- IEC 62007-1, Edition 3.0, Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
- IEC 62047-15, Edition 1.0, Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
- IEC 62047-16, Edition 1.0, Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
- IEC 62047-17, Edition 1.0, Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
For more standards like these, please see our Document Center List of Standards on Semiconductor Devices.
