- IEC 62866, Edition 1.0, Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
- IEC/PAS 61249-8-1, Edition 1.0, Qualification and performance of electrical insulating compound for printed wiring assemblies
- IEC/PAS 61249-8-5, Edition 1.0, Qualification and performance specification of permanent solder mask and flexible cover materials
- IPC 4101, Revision D, Specification for Base Materials for Rigid and Multilayer Printed Boards
- IPC 8701, 2014 First Release, Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
- IPC A 610, Revision F, Acceptability of Electronic Assemblies
- J-STD-001, Revision F, Requirements for Soldered Electrical and Electronic Assemblies
- J-STD-030, Revision A, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
For more standards like these, please see our Document Center List of Standards on Printed Circuits And Boards.
You'll also want to review my previous blog:
